Yuanzhu Series Functional Ceramic Microspheres
Product Overview
Electrospray-derived mesoporous ceramic microspheres serve as fillers for electromagnetic functionality, stealth, and thermal insulation. The product line includes three categories: microwave-absorbing microspheres, infrared-stealth microspheres, and high-strength, toughened thermal-insulation microspheres.
Details & Technical Specifications
Series Positioning
The Yuanzhu series is a multi-scale porous ceramic microsphere platform prepared via electrospray, combining dielectric and magnetic losses for use as electromagnetic functional, stealth, and thermal insulation fillers. It covers three key application areas: electromagnetic wave absorption, infrared stealth, and high-strength/high-toughness thermal insulation, tailored for aerospace and hypersonic flight systems.
1. Electromagnetic Wave Absorbing Microspheres
Parameters | SiC/C | HEC/C |
|---|---|---|
Components | SiC + Pyrolytic Carbon | Rare Earth High-Entropy Carbides + Pyrolytic Carbon |
Granular structure | Gradient Pores (Finger-like/Cellular/Nanopores) | gradient hole |
RLmin | -48.9 dB (9.8 GHz) | -19.8 dB (11.3 GHz) |
Effective Bandwidth | 3.0 GHz (X, Ku bands) | 6.0 GHz |
4/5/6GHz Absorption Rate | - | 36%/55%/68% |
II. Infrared Stealth Microspheres
Parameters | LZO | Rare-earth-doped LZO |
|---|---|---|
Components | La2Zr2O7 | Low-entropy/High-entropy lanthanum zirconate |
Granular structure | Epidermal layer + finger-like pores + sponge-like pores, porosity 62 → 16% | Finger-like pores + sponge pores + nano-micropores |
Single-Sphere Thermal Conductivity | 0.52-1.65 W/(m·K) | Intrinsic minimum 0.2098 W/(m·K) |
Radiative thermal conductivity | 0.15 W/(m·K) | - |
3-5μm integrated emissivity | - | 0.266-0.346 |
III. High-Strength and Tough Insulating Microspheres
Parameters | ESP glass | ESP Ceramic | ESP Glass |
|---|---|---|---|
Components | SiO2-based glass | YSZ / Aluminum silicate and other oxides | Glass-ceramic composite |
Granular structure | Hierarchical pores, porosity ≥ 80% | Bamboo-joint hierarchical pores, porosity ≥ 56% | Hierarchical pores, porosity ≥ 56% |
Thermal Conductivity | 0.050 W/m·K (800°C 0.07) | 0.07-0.12 W/m·K | 0.07 W/m·K (800°C 0.07) |
Fracture / Compressive Strength | 37.9 kPa | 164 MPa | 80 MPa |
Heat resistance temperature | 1100℃ | 1800℃ | 1600℃ |
Other Thermal Barrier Coating Fillers
Parameters | ES-PIYSZ |
|---|---|
Components | ZrO2-Y2O3 YSZ |
Granular structure | Hierarchical pores, porosity 72→38% |
Thermal conductivity of microspheres | 0.75 W/m·K |
Coating thermal conductivity | 0.7 W/m·K |
Modulus of Elasticity | 22 GPa |
Use Cases
Fillers for Electromagnetic Wave Absorbing Stealth Coatings
Infrared Stealth Coating Fillers
High-temperature insulation filler
Thermal Barrier Coating Filler
Aerospace and Hypersonic Vehicles
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